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XDM®-100 Product Line

Version 8.3

Reference Manual

417006-2709-0H3-B02


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XDM-100 Product Line (ETSI) Reference Manual

V8.3

Catalog No: X39175December 2011

10th Edition

© Copyright by ECI Telecom, 2007-2011. All rights reserved worldwide.

This is a legal agreement between you, the end user, and ECI Telecom Ltd. (“ECI Telecom”). BY OPENING THEDOCUMENTATION AND/OR DISK PACKAGE, YOU ARE AGREEING TO BE BOUND BY THE TERMS OF THIS

AGREEMENT. IF YOU DO NOT AGREE TO THE TERMS OF THIS AGREEMENT, PROMPTLY RETURN THE

UNOPENED DOCUMENTATION AND/OR DISK PACKAGE AND THE ACCOMPANYING ITEMS (INCLUDINGWRITTEN MATERIALS AND BINDERS OR OTHER CONTAINERS), TO THE PLACE FROM WHICH YOUOBTAINED THEM.

The information contained in the documentation and/or disk is proprietary and is subject to al l relevant copyright,patent, and other laws protecting intellectual property, as well as any specific agreement protecting ECI Telecom'srights in the aforesaid information. Neither this document nor the information contained in the documentation and/ordisk may be published, reproduced, or disclosed to third parties, in whole or in part, without the express priorwritten permission of ECI Telecom. In addition, any use of this document, the documentation and/or the disk, or theinformation contained therein for any purposes other than those for which it was disclosed, is strictly forbidden.

ECI Telecom reserves the right, without prior notice or liability, to make changes in equipment design orspecifications. Information supplied by ECI Telecom is believed to be accurate and reliable. However, noresponsibility whatsoever is assumed by ECI Telecom for the use thereof, nor for the rights of third parties, whichmay be affected in any way by the use and/or dissemination thereof.

Any representation(s) in the documentation and/or disk concerning performance of ECI Telecom product(s) are forinformational purposes only and are not warranties of product performance or otherwise, either express or implied.

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The end user hereby undertakes and acknowledges that they read the "Before You Start/Safety Guidelines"instructions and that such instructions were understood by them.

It is hereby clarified that ECI Telecom shall not be liable to you or to any other party for any loss or damagewhatsoever or howsoever caused, arising directly or indirectly in connection with you fulfilling and/or failed to fulfillin whole or in part the "Before You Start/Safety Guidelines" instructions.


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Contents About This Manual ................................................................... xv

Overview ............................................................................................................ xvIntended Audience ............................................................................................. xvDocument Organization ..................................................................................... xviDocument Conventions ..................................................................................... xviRelated Documentation ....................................................................................xviiiObtaining Technical Documentation ................................................................xviiiTechnical Assistance ......................................................................................... xix

Introduct ion .............................................................................. 1-1XDM-50 Platform Overview .............................................................................. 1-2XDM-50 Shelf Options ...................................................................................... 1-3XDM-100 Platform Overview ............................................................................ 1-5XDM-100 Shelf Configurations ......................................................................... 1-6XDM-100 I/O Protection Options ...................................................................... 1-8XDM-100H Overview ...................................................................................... 1-10XDM-300 Platform Overview .......................................................................... 1-16XDM-300 I/O Protection Options .................................................................... 1-17XDM-900 Platform Overview .......................................................................... 1-23XDM-900 I/O Protection Options .................................................................... 1-25DCC Functionality .......................................................................................... 1-30Management Architecture .............................................................................. 1-33

XDM-50 Common Cards .......................................................... 2-1Overview .......................................................................................................... 2-1Main Cross-Connect and Control (MXC50) Card ............................................. 2-2External Connection Unit (ECU50/ECU50-R) .................................................. 2-5Fan Control Unit (FCU50) .............................................................................. 2-11INF50 .............................................................................................................. 2-13CCP50-2 ......................................................................................................... 2-14

XDM-100 Common Cards ........................................................ 3-1Shelf Overview ................................................................................................. 3-2Fan Control Unit (FCU) .................................................................................... 3-3External Connection Unit (ECU) ....................................................................... 3-6Main Cross-Connect and Control (MXC) Card ............................................... 3-11


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XDM-300 Common Cards ........................................................ 4-1XDM-300 Shelf Overview ................................................................................. 4-1

Fan Control Unit (FCU300) .............................................................................. 4-2External Connection Unit (ECU300) ................................................................. 4-6Main Cross-Connect and Control Card (MXC300) ......................................... 4-12XDM-300 Platform with 100 Gbps Capacity ................................................... 4-15

XDM-900 Common Cards ........................................................ 5-1XDM-900 Shelf Overview ................................................................................. 5-1Fan Control Unit (FCU900) .............................................................................. 5-2External Connection Unit (ECU900) ................................................................. 5-6Main Cross-Connect and Control Card (MXC900) ......................................... 5-11XDM-900 Platform with 60 Gbps Capacity ..................................................... 5-14

I/O Cards and Modules ............................................................ 6-1Overview .......................................................................................................... 6-1PDH Modules ................................................................................................... 6-4SDH Cards and Modules ................................................................................ 6-15CWDM I/O Modules ....................................................................................... 6-39Pluggable Interfaces (SFP/XFP) .................................................................... 6-42Overhead Access Module (OHU) ................................................................... 6-45

MPLS and Ethernet Data Modules ......................................... 7-1Overview .......................................................................................................... 7-1

Ethernet Switching Modules ............................................................................. 7-3EISMB Functionality ......................................................................................... 7-4EISMB Module Types ..................................................................................... 7-11DIOM Modules ............................................................................................... 7-17DIOM Module Types ...................................................................................... 7-17MCSM ............................................................................................................ 7-25

ASON (Automat ically Switched Opt ical Network) ................ 8-1Overview .......................................................................................................... 8-1Optical Control Plane Architecture ................................................................... 8-2 ASON Traffic Management .............................................................................. 8-6

ACP100 Module ............................................................................................... 8-9 ACP900 Module ............................................................................................. 8-11


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Contents

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Tributary Protection Unit (TPU) .............................................. 9-1Overview .......................................................................................................... 9-1

TC Modules ...................................................................................................... 9-5TPMs ................................................................................................................ 9-8TPU and I/O Slots Allocation for Protection ................................................... 9-15Optical Amplifiers ........................................................................................... 9-19TPU/OCU Shelf .............................................................................................. 9-24CWDM Networking Modules .......................................................................... 9-24

Accessories ......................................................................... 10-35Overview ...................................................................................................... 10-35xRAP-100 ..................................................................................................... 10-36xRAP-D ........................................................................................................ 10-40

RAP-BG ........................................................................................................ 10-46RAP-4B ........................................................................................................ 10-47xDDF-21 Patch Panel for Unbalanced Electrical Connections ..................... 10-50Fiber Storage Tray (FST) ............................................................................. 10-51Optical Distribution Frame ............................................................................ 10-52Optical Patch Panel ...................................................................................... 10-54Cable Guiding Accessories .......................................................................... 10-55

XDM Protection and Restoration Mechanisms ................... 11-1Overview ........................................................................................................ 11-1 ASON Protection and Restoration Capabilities .............................................. 11-2

MPLS Protection Schemes ............................................................................ 11-6Ethernet PB Features ................................................................................... 11-11Fast IOP: 1:1 Card Protection ...................................................................... 11-13SDH Protection Schemes ............................................................................. 11-14SDH Line Protection ..................................................................................... 11-19Equipment Protection ................................................................................... 11-22Integrated Protection for I/O Cards with Electrical Interfaces ....................... 11-23

Maintenance ........................................................................... 12-1Overview ........................................................................................................ 12-1Short MTTR .................................................................................................... 12-2Built-In Test .................................................................................................... 12-3 Alarms System ............................................................................................... 12-4Troubleshooting .............................................................................................. 12-5


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Standards and References .................................................... A-1Overview .......................................................................................................... A-1

Broadband Forum ............................................................................................ A-2Environmental Standards ................................................................................. A-2ETSI: European Telecommunications Standards Institute ............................... A-3IEC: International Electrotechnical Commission .............................................. A-4IEEE: Institute of Electrical and Electronic Engineers ...................................... A-5IETF: Internet Engineering Task Force ............................................................ A-6ISO: International Organization for Standardization ......................................... A-8ITU-T: International Telecommunication Union ................................................ A-9MEF: Metro Ethernet Forum ........................................................................... A-14NIST: National Institute of Standards and Technology .................................. A-14North American Standards ............................................................................. A-15OMG: Object Management Group ................................................................. A-16TMF: TeleManagement Forum ....................................................................... A-16Web Protocol Standards ................................................................................ A-16

Index .......................................................................................... I-1


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List of FiguresFigure 1-1: XDM-50 shelf ............................................................................................... 1-2

Figure 1-2: Basic XDM-50 shelf layout .......................................................................... 1-4

Figure 1-3: XDM-100 shelf ............................................................................................. 1-5

Figure 1-4: Basic XDM-100 shelf ................................................................................... 1-8

Figure 1-5: Expanded XDM-100 shelf ............................................................................ 1-9

Figure 1-6: Double-expanded XDM-100 shelf ............................................................... 1-9

Figure 1-7: XDM-100 with a TPU/OCU shelf ............................................................... 1-11

Figure 1-8: TPU and OCU slots designation ................................................................ 1-12

Figure 1-9: Basic XDM-100 .......................................................................................... 1-13

Figure 1-10: Expanded XDM-100 ................................................................................ 1-14

Figure 1-11: Double-expanded XDM-100 .................................................................... 1-15

Figure 1-12: XDM-300 shelf ......................................................................................... 1-16

Figure 1-13: Basic XDM-300 shelf, horizontal installation ........................................... 1-18

Figure 1-14: Basic XDM-300 shelf, vertical Installation ............................................... 1-19

Figure 1-15: XDM-300 with TPU on top ....................................................................... 1-20

Figure 1-16: XDM-300 with TPUs on top and at the bottom ........................................ 1-21

Figure 1-17: XDM-300 with two TPUs and an OCU .................................................... 1-22

Figure 1-18: XDM-900 shelf ......................................................................................... 1-23

Figure 1-19: Basic XDM-900 shelf, horizontal installation ........................................... 1-26

Figure 1-20: Basic XDM-900 shelf, vertical Installation ............................................... 1-26

Figure 1-21: XDM-900 with TPU on top ....................................................................... 1-27

Figure 1-22: XDM-900 with TPUs on top and at the bottom ........................................ 1-28

Figure 1-23: XDM-900 with two TPUs and an OCU .................................................... 1-29

Figure 1-24: XDM-100 DCC capacity before modification ........................................... 1-30

Figure 1-25: XDM-100 DCC capacity after modification .............................................. 1-31

Figure 1-26: XDM-300/XDM-900 DCC capacity before modification........................... 1-31

Figure 1-27: XDM-300/XDM-900 DCC capacity after modification .............................. 1-32

Figure 1-28: Typical XDM-100 Shelf View ................................................................... 1-33

Figure 1-29: Typical XDM-100 Shelf window ............................................................... 1-34

Figure 2-1: Basic XDM-50 shelf layout .......................................................................... 2-2

Figure 2-2: MXC50 front panel ....................................................................................... 2-3

Figure 2-3: ECU50 front panel ....................................................................................... 2-6

Figure 2-4: ECU50_R front panel .................................................................................. 2-9

Figure 2-5: FCU50 front panel ..................................................................................... 2-11

Figure 2-6: Installed air filter ......................................................................................... 2-12

Figure 2-7: INF50 front panel ....................................................................................... 2-13


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Figure 2-8: CCP50-2 module front panel ..................................................................... 2-14

Figure 3-1: Basic XDM-100 shelf ................................................................................... 3-2

Figure 3-2: FCU general view ........................................................................................ 3-3

Figure 3-3: Installed air filter ........................................................................................... 3-5

Figure 3-4: ECU-F front panel ........................................................................................ 3-7

Figure 3-5: ECU front panel ........................................................................................... 3-9

Figure 3-6: XDM-100 with two MXC-100 slots capacity .............................................. 3-12

Figure 3-7: MXC-100 front panel ................................................................................. 3-12

Figure 3-8: XDM-100 with two MXC-100B slots capacity ............................................ 3-15

Figure 3-9: MXC-100B front panel ............................................................................... 3-15

Figure 3-10: XDM-100 with one MXC-100 and one MXC-BR slots capacity ............... 3-16

Figure 3-11: MXC-BR front panel ................................................................................ 3-16

Figure 3-12: Shelf with MXC-100 redundancy ............................................................. 3-17

Figure 3-13: Shelf without MXC redundancy ............................................................... 3-19

Figure 3-14: SAM1_4/E ................................................................................................ 3-21

Figure 3-15: SAM1_4O/SAM1_4OB aggregate module .............................................. 3-22

Figure 3-16: SAM4_2 aggregate module ..................................................................... 3-23

Figure 3-17: SAM16_1/SAM16_1B .............................................................................. 3-24

Figure 4-1: FCU300 general view .................................................................................. 4-3

Figure 4-2: XDM-300 with air filter ................................................................................. 4-5

Figure 4-3: ECU300-F front panel .................................................................................. 4-6

Figure 4-4: ECU300 front panel ..................................................................................... 4-9

Figure 4-5: MXC300 front panel ................................................................................... 4-13

Figure 4-6: Warning labels on extractor handles ......................................................... 4-13

Figure 4-7: XDM-300_100G slot capacity .................................................................... 4-15

Figure 5-1: FCU900 general view .................................................................................. 5-3

Figure 5-2: XDM-900 with air filter ................................................................................. 5-5

Figure 5-3: ECU900-F front panel .................................................................................. 5-6

Figure 5-4: ECU900 front panel ..................................................................................... 5-9

Figure 5-5: MXC900 front panel ................................................................................... 5-12

Figure 5-6: Warning labels on extractor handles ......................................................... 5-12

Figure 6-1: PIM2_21 I/O module .................................................................................... 6-5

Figure 6-2: PIM2_42 front panel .................................................................................... 6-7

Figure 6-3: PIM2_63/B I/O module ................................................................................ 6-9

Figure 6-4: PIM2_63 front panel .................................................................................. 6-11

Figure 6-5: PIM2_63S traffic cable .............................................................................. 6-12

Figure 6-6: PIM345_3 I/O module ................................................................................ 6-13

Figure 6-7: SIM1_4/E I/O module ................................................................................ 6-16

Figure 6-8: SIM 1_4/O and SIM1_4OB I/O module ..................................................... 6-18


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Figure 6-9: SIM1_8 front panel .................................................................................... 6-20

Figure 6-10: SIM4_2 I/O module .................................................................................. 6-21

Figure 6-11: SIM4_4 front panel .................................................................................. 6-23

Figure 6-12: SIM4_8 front panel .................................................................................. 6-25

Figure 6-13: SIM16_1 front panel ................................................................................ 6-27



Figure 6-16: Warning labels on extractor handles ....................................................... 6-30

Figure 6-17: SIM16_8 ports and bandwidth assignment ............................................. 6-31




Figure 6-21: SIM64_XFP front panel ........................................................................... 6-36




Figure 6-25: CRPT25_2C module ............................................................................... 6-39

Figure 6-26: CTRP25_2C module ............................................................................... 6-40

Figure 6-27: CCMB25_2D module ............................................................................... 6-41

Figure 6-28: SFP transceiver ....................................................................................... 6-42

Figure 6-29: OHU front panel ....................................................................................... 6-45

Figure 7-1: EISMB_804 front panel ............................................................................. 7-13

Figure 7-2: EISMB_840 front panel ............................................................................. 7-16

Figure 7-3: DIOM_04 front panel ................................................................................. 7-19



Figure 7-6: MCSM functional block diagram ................................................................ 7-25

Figure 7-7: MCSM front panel ...................................................................................... 7-30

Figure 8-1: XDM control plane architecture ................................................................... 8-2

Figure 8-2: ASON family software structure .................................................................. 8-7

Figure 8-3: ASON software structure ............................................................................. 8-8

Figure 8-4: ACP100 front panel ..................................................................................... 8-9

Figure 8-5: ACP900 front panel ................................................................................... 8-11

Figure 9-1: XDM-50 with TPU ........................................................................................ 9-2

Figure 9-2: XDM-100 with TPU ...................................................................................... 9-3

Figure 9-3: XDM-300 with two TPUs ............................................................................. 9-3

Figure 9-4: XDM-900 with two TPUs ............................................................................. 9-4

Figure 9-5: TC module ................................................................................................... 9-5

Figure 9-6: TCF module ................................................................................................. 9-7


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Figure 9-7: TPM2_1 protection module ......................................................................... 9-9

Figure 9-8: TPM2_3 front panel ................................................................................... 9-10

Figure 9-9: TPM2_42_2 front panel ............................................................................. 9-11

Figure 9-10: TPM2_63_2 front panel ........................................................................... 9-12

Figure 9-11: TPM2_63_3 Front Panel ......................................................................... 9-13

Figure 9-12: TPMH_1 ................................................................................................... 9-14

Figure 9-13: MO_DC0_BAS front panel ...................................................................... 9-20

Figure 9-14: MO_PAS_DCM80 front panel ................................................................. 9-21

Figure 9-15: MO_OFA21 front panel ........................................................................... 9-23

Figure 9-16: MO_CMD4C module ............................................................................... 9-25

Figure 9-17: MO_CMD8 module .................................................................................. 9-26

Figure 9-18: MO_CMD4C_E module ........................................................................... 9-27

Figure 9-19: MO_CMD4SL module ............................................................................. 9-28

Figure 9-20: Typical MO_COADM1AB_xx module ...................................................... 9-29

Figure 9-21: Typical MO_COADM2AB_Gxx module ................................................... 9-30

Figure 9-22: MO_4CP4SPMM50 module .................................................................... 9-31

Figure 9-23: MO_4CP4SPMM62 module .................................................................... 9-32

Figure 9-24: MO_4CP4SPSM module ......................................................................... 9-33

Figure 10-1: xRAP-100 front panel ............................................................................ 10-37

Figure 10-2: xRAP-100 connectors ............................................................................ 10-39

Figure 10-3: xRAP-D power supply flow .................................................................... 10-40

Figure 10-4: xRAP-D front panel ................................................................................ 10-43

Figure 10-5: xRAP-D connectors ............................................................................... 10-44

Figure 10-6: Y-cable connection ................................................................................ 10-45

Figure 10-7: Double-Y cable connection .................................................................... 10-45

Figure 10-8: RAP-BG front panel ............................................................................... 10-46

Figure 10-9: RAP-4B front panel ................................................................................ 10-48

Figure 10-10: RAP-4B alarm connectors ................................................................... 10-49

Figure 10-11: xDDF-21 patch panel for unbalanced E1 interfaces............................ 10-50

Figure 10-12: Label inside xDDF-21 patch panel door .............................................. 10-50

Figure 10-13: FST top view ........................................................................................ 10-51

Figure 10-14: ODF internal view ................................................................................ 10-52

Figure 10-15: ODF front panel ................................................................................... 10-53

Figure 10-16: OPP top view ....................................................................................... 10-54

Figure 10-17: Cable guide .......................................................................................... 10-55

Figure 10-18: Fiber guide for ETSI A racks ............................................................... 10-55

Figure 10-19: PIM2_63S traffic cable box tray for above shelf installations .............. 10-56

Figure 10-20: PIM2_63S traffic cable box tray for under shelf installations .............. 10-57

Figure 10-21: Cable slack tray ................................................................................... 10-57


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Figure 11-1: 1++ protection .......................................................................................... 11-3

Figure 11-2: 1+R protection ......................................................................................... 11-4

Figure 11-3: Comprehensive protection ....................................................................... 11-6

Figure 11-4: P2MP link protection example ................................................................. 11-7

Figure 11-5: P2MP node protection example .............................................................. 11-8

Figure 11-6: H-VPLS with dual homing for access rings ............................................. 11-9

Figure 11-7: LAG scenario ......................................................................................... 11-10

Figure 11-8: Ethernet ring protection ......................................................................... 11-12

Figure 11-9: Fast IOP protection ................................................................................ 11-13

Figure 11-10: Typical SNCP-protected network sites ................................................ 11-15

Figure 11-11: SNCP-protected XDM sites ................................................................. 11-16

Figure 11-12: MSP protection modes ........................................................................ 11-19

Figure 11-13: Two-fiber protection ............................................................................. 11-21


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List of TablesTable 1-1: Supported modules in basic and hybrid XDM-100 .............................. 1-13

Table 1-2: Supported modules in expanded XDM-100 ........................................ 1-14

Table 1-3: Supported modules in double-expanded XDM-100 ............................ 1-15

Table 2-1: MXC50 indicators and functions ............................................................ 2-4

Table 2-2: ECU50 indicators and functions ............................................................ 2-6

Table 2-3: ECU50-R indicators and functions ........................................................ 2-9

Table 2-4: FCU front panel LED indicators ........................................................... 2-11

Table 2-5: INF50 front panel LED indicators ........................................................ 2-13

Table 2-6:

CCP50-2 indicators and functions ....................................................... 2-14

Table 3-1:

FCU front panel LED indicators ............................................................. 3-4

Table 3-2: ECU300-F indicators and functions ....................................................... 3-7

Table 3-3: ECU100 indicators and functions .......................................................... 3-9

Table 3-4: MXC-100 indicators and functions ...................................................... 3-13

Table 3-5:

MXC-100B indicators and functions .................................................... 3-15

Table 3-6: Available aggregate module types ...................................................... 3-20

Table 3-7: SAM1_4/E front panel LED indicators ................................................. 3-21

Table 3-8: SAM1_4O/SAM1_4OB front panel LED indicators ............................. 3-22

Table 3-9: SAM4_2 front panel LED indicators .................................................... 3-23

Table 3-10: SAM16_1/SAM16_1B front panel LED indicators ............................... 3-24

Table 4-1: FCU300 front panel indicators ............................................................... 4-3


Table 4-3: ECU300 indicators and functions ........................................................ 4-10

Table 4-4: MXC300 indicators and functions ........................................................ 4-14

Table 5-1: FCU900 front panel indicators ............................................................... 5-3


Table 5-3: ECU900 indicators and functions .......................................................... 5-9

Table 5-4: MXC900 indicators and functions ........................................................ 5-13

Table 6-1:

PDH and SDH I/O modules and cards .................................................. 6-2

Table 6-2: PDH I/O module types ........................................................................... 6-4

Table 6-3: PIM2_21 modules and E1 interfaces per shelf ..................................... 6-5

Table 6-4: PIM2_21 front panel LED indicators ...................................................... 6-6

Table 6-5: PIM2_42 modules and E1 interfaces per shelf ..................................... 6-7

Table 6-6: PIM2_42 front panel LED indicators ...................................................... 6-7

Table 6-7: PIM2_63/B modules and E1 interfaces per shelf .................................. 6-8

Table 6-8: PIM2_63/B front panel LED indicators .................................................. 6-9

Table 6-9: PIM2_63S modules and E1 interfaces per shelf ................................. 6-10


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Table 6-10: PIM2_63S front panel LED indicator ................................................... 6-11

Table 6-11: PIM345_3 modules and E3/DS-3/STS-1 interfaces per shelf ............. 6-13

Table 6-12:

PIM345_3 front panel LED indicators .................................................. 6-14

Table 6-13: SDH I/O module and card types .......................................................... 6-15

Table 6-14: SIM1_4/E modules and OC-3 interfaces per shelf .............................. 6-16

Table 6-15: SIM1_4/E front panel LED indicators .................................................. 6-17

Table 6-16: SIM1_4/O or SIM1_4OB modules and OC-3 interfaces per shelf ...... 6-17

Table 6-17: SIM1_4/O and SIM1_4OB front panel LED indicators ........................ 6-18

Table 6-18: SIM1_8 modules and OC-3 interfaces per shelf ................................. 6-19

Table 6-19: SIM1_8 front panel LED indicators ...................................................... 6-20

Table 6-20: SIM4_2 modules and OC-12 interfaces per shelf ............................... 6-21

Table 6-21:

SIM4_2 front panel LED indicators ...................................................... 6-22

Table 6-22: SIM4_4 modules and STM-1/4 interfaces per shelf ............................ 6-22


Table 6-24: SIM4_8 modules and STM-1/4 interfaces per shelf ............................ 6-24


Table 6-26: SIM16_1 modules and STM-16 interfaces per shelf ........................... 6-26

Table 6-27: SIM16_1 front panel LED indicators .................................................... 6-27

Table 6-28: SIM16_2 modules and STM-16 interfaces per shelf ........................... 6-28


Table 6-30: SIM16_4 cards and STM-16 interfaces per shelf ................................ 6-29

Table 6-31:

SIM16_4 front panel LED indicators .................................................... 6-30

Table 6-32: SIM16_8 cards and STM-16 and STM-1/4 interfaces per shelf .......... 6-32


Table 6-34: SIM64_1 cards and STM-64 interfaces per shelf ................................ 6-34


Table 6-36: SIM64_XFP cards and STM-64 interfaces per shelf ........................... 6-35

Table 6-37: SIM64_XFP front panel LED indicators ............................................... 6-36

Table 6-38:

SIM64_2 cards and STM-64 interfaces per shelf ................................ 6-37


Table 6-40:

CRPT25_2C front panel LED indicators .............................................. 6-40

Table 6-41: CTRP25_2C front panel LED indicators .............................................. 6-40

Table 6-42:

CCMB25_2D front panel LED indicators ............................................. 6-41

Table 6-43: OHU indicators and functions .............................................................. 6-46

Table 7-1: Data module types ................................................................................. 7-2

Table 7-2: EISMB_804 modules and Ethernet interfaces per shelf ..................... 7-12

Table 7-3: EISMB_804 main and protection module slots per shelf .................... 7-13

Table 7-4: EISMB_804 front panel LED indicators ............................................... 7-14

Table 7-5: EISMB_840 modules and Ethernet interfaces per shelf ..................... 7-15


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Table 7-6: EISMB_840 main and protection module slots per shelf .................... 7-15

Table 7-7: Port cable options ................................................................................ 7-16

Table 7-8:

EISMB_840 main and protection module slots per shelf .................... 7-16

Table 7-9: DIOM_04 modules and Ethernet interfaces per shelf ......................... 7-18

Table 7-10: DIOM_04 main and protection module slots per shelf ........................ 7-18

Table 7-11: DIOM_04 front panel LED indicators ................................................... 7-19






Table 7-17:

Port cable options ................................................................................ 7-23


Table 7-19: MCSM port numbering and assignment .............................................. 7-26

Table 7-20: MCSM WAN port specifications .......................................................... 7-27

Table 7-21: MCSM modules and Ethernet interfaces per shelf .............................. 7-28

Table 7-22: MCSM main and protection module slots per shelf ............................. 7-28

Table 7-23: MCSM front panel LED indicators ....................................................... 7-30

Table 8-1: ACP100 front panel LED indicators and connectors ........................... 8-10

Table 8-2: ACP900 front panel LED indicators and connectors ........................... 8-12

Table 9-1: TC front panel LED indicators ............................................................... 9-6

Table 9-2:

TCF front panel LED indicators ............................................................. 9-7

Table 9-3: TPM2_1 front panel LED indicators ...................................................... 9-9

Table 9-4: TPM2_3 front panel LED indicators .................................................... 9-10

Table 9-5: TPM2_42_2 front panel LED indicators .............................................. 9-11



Table 9-8: TPMH_1 front panel LED indicators .................................................... 9-14

Table 9-9:

XDM-50 slots allocation for protection schemes ................................. 9-15

Table 9-10: XDM-100 slots allocation for protection schemes ............................... 9-16

Table 9-11:

XDM-300 slots allocation for protection schemes ............................... 9-17

Table 9-12: XDM-900 slots allocation for protection schemes ............................... 9-18

Table 9-13:

MO_DC0_BAS indicators .................................................................... 9-20

Table 9-14: MO_PAS_DCM80 indicators ............................................................... 9-22

Table 9-15: MO_OFA21 indicators ......................................................................... 9-23

Table 9-16: MO_CMD4C front panel LED indicators ............................................. 9-25

Table 9-17: MO_CMD8 front panel LED indicators ................................................ 9-26

Table 9-18: MO_CMD4C_E front panel LED indicators ......................................... 9-27

Table 9-19: MO_CMD4SL front panel LED indicators............................................ 9-28


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Table 9-20: MO_COADM1AB_xx front panel LED indicators ................................ 9-29

Table 9-21: MO_COADM2AB_Gxx front panel LED indicators ............................. 9-30

Table 9-22:

MO_4CP4SPMM50 front panel LED indicators .................................. 9-31

Table 9-23: MO_4CP4SPMM62 front panel LED indicators .................................. 9-32

Table 9-24: MO_4CP4SPSM front panel LED indicators ....................................... 9-33

Table 10-1: xRAP-100 front panel component functions ...................................... 10-38

Table 10-2: xRAP-100 connectors........................................................................ 10-39

Table 10-3: xRAP-D front panel component functions ......................................... 10-43

Table 10-4: xRAP-D connector functions ............................................................. 10-44

Table 10-5: RAP-BG front panel component functions ........................................ 10-46

Table 10-6: RAP-4B front panel component functions ......................................... 10-48

Table 10-7:

RAP-4B connector functions ............................................................. 10-49

Table 10-8: XDM-100 cables ................................................................................ 10-58


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417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary xv

In this chapter:

Overview .......................................................................................................... xv

Intended Audience ............................................................................................ xv

Document Organization ................................................................................... xvi

Document Conventions ................................................................................... xvi

Related Documentation ................................................................................. xviii

Obtaining Technical Documentation ............................................................. xviii

Technical Assistance ....................................................................................... xix

OverviewThe XDM®-100 Product Line Reference Manual describes the key

components of the XDM-50, XDM-100, XDM-300, and XDM-900 including

cards, modules, accessories, and related capabilities.

It also provides detailed descriptions for interpreting indicator functions,

enabling field personnel to troubleshoot hardware-related problems.

Intended AudienceThe XDM®-100 Product Line Reference Manual is intended for field and other

qualified service personnel responsible for installing the XDM-50, XDM-100,

XDM-300, and XDM-900 and their accessories.

About This Manual


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About This Manual XDM-100 Product Line Reference

Manual

xvi ECI Telecom Ltd. Proprietary 417006-2709-0H3-B02

Document OrganizationThis Reference Manual contains the following information:

XDM-50, XDM-100, XDM-300, and XDM-900 shelves overview

XDM-50, XDM-100, XDM-300, and XDM-900 common cards

Cards and modules used in the three products

Tributary Protection Unit (TPU)

Accessories

Additional functionality

Document ConventionsWhen applicable, this manual uses the following conventions.

Convention Indicates Example

Bold Names of windows, dialog boxes, menus, buttons, and

most other GUI elements

On the Alarms menu...

Menu > Option Selection from a menu, or

leading to anothercommand

Select Update > View

Objects

Italics New terms, emphasizedtext, and names of manualsand documents

Examples in text

Borders around text Notes, cautions, andwarnings

See examples below


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About This Manual

417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary xvii

NOTE: Text set off in this manner presents clarifying

information, specific instructions, commentary, sidelights, orinteresting points of information.

CAUTION: Text set off in this manner indicates that failure tofollow directions could result in damage to equipment or lossof information.

WARNING: Text set off in this manner indicates that failureto follow directions could result in bodily harm or loss of life.

LASER WARNING: Text set off in this manner indicates howto avoid personal injury. All personnel involved in equipmentinstallation, operation, and maintenance must be aware thatlaser radiation is invisible. Therefore, although protectivedevices generally prevent direct exposure to the beam, personnel must strictly observe the applicable safety

precautions and, in particular, must avoid staring into opticalconnectors, either directly or using optical instruments.

ESD: Text set off in this manner indicates information onhow to avoid discharge of static electricity and subsequentdamage to the unit.

TIP: Text set off in this manner includes helpful informationand handy hints that can make your task easier.

IMPORTANT: Text set off in this manner presents essentialinformation to which you must pay attention.


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xviii ECI Telecom Ltd. Proprietary 417006-2709-0H3-B02

Related DocumentationThe following publications may be of assistance to you in the installation and

commissioning processes of the XDM-100 Product Line:

Multiservice Packet-Optical Transport Platform General Description

XDM-50 Installation and Maintenance Manual




EMS-XDM User Manual

LightSoft®

User Manual

Obtaining Technical

DocumentationTo obtain technical documentation related to ECI Telecom products, contact:

ECI Telecom Ltd.

Documentation Department

30 Hasivim St.

Petach Tikva 49130Israel

Fax: +972-3-9268060

Email: [email protected]


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About This Manual

417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary xix

Technical AssistanceThe configuration, installation, and operation of the XDM-100 Product Line

and its operation in a network are highly specialized processes. Due to the

different nature of each installation, some planning aspects may not be covered

in this manual.

If you have questions or concerns about your network design or if you require

installation personnel to perform the actual installation process, ECI Telecom

maintains a staff of design engineers and highly trained field service personnel.

The services of this group are available to customers at any time.

If you are interested in obtaining design assistance or a network installation

plan from ECI Telecom's Customer Support team, contact your ECI Telecom

sales representative. With any support related issues, technical or logistic,

contact the ECI Telecom Customer Support center at your location or our

central customer support center action line at:

Telephone +972-3-9266000

Telefax +972-3-9266370

Email [email protected]

ECI Telecom's XDM and BroadGate® product lines arecertified to comply with MEF9 and MEF14 standards.

ECI Telecom's qualification lab is accredited by A2LA forcompetence in electrical testing according to the InternationalStandard ISO IEC 17025-2005 General Requirements for theCompetence of Testing and Calibration Laboratories.

mailto:[email protected]:[email protected]:[email protected]


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417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary 1-1

In this chapter:

XDM-50 Platform Overview ........................................................................... 1-2

XDM-50 Shelf Options ................................................................................... 1-3

XDM-100 Platform Overview ......................................................................... 1-5

XDM-100 Shelf Configurations ...................................................................... 1-6

XDM-100 I/O Protection Options ................................................................... 1-8

XDM-100H Overview ................................................................................... 1-10

XDM-300 Platform Overview ....................................................................... 1-16

XDM-300 I/O Protection Options ................................................................. 1-17

XDM-900 Platform Overview ....................................................................... 1-23 XDM-900 I/O Protection Options ................................................................. 1-25

DCC Functionality ......................................................................................... 1-30

Management Architecture ............................................................................. 1-33

1

Introduction


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XDM-50 Platform OverviewECI Telecom's XDM-50 is a miniature add/drop multiplexer optimized

especially for metro-access and cellular networks.

The XDM-50 compact multiservice platform delivers a cost-effective and

affordable mix of Ethernet, SDH and PDH services, resulting in new revenue-

generating opportunities. It offers a wide variety of features and benefits,

including:

Highly cost-effective, redundant, and flexible ADM-1/4 and TM-1/4

solution in line with the XDM build-as-you-grow architecture™, providing

significant savings in both OPEX and CAPEX.

Minimal physical size, broad flexibility, and scalability.

Operational within an extended range of environmental conditions.

Ample versatility, supporting PDH, SDH, and Ethernet interfaces and

services.

Compatible with XDM family counterparts, including most I/O TPU and

SFP modules.

Upgradable to SDH/CWDM sublambda grooming for transporting SAN

and data services in the metro-access portion of the network.

The XDM-50 is compact and resilient, making it perfectly suited for both

indoor and outdoor enclosures. Due to its extended operating temperature

range, it is also well suited for harsh environmental conditions.The XDM-50 shelf was designed to facilitate simple installation and

maintenance. Hot insertion of cards and modules is allowed, supporting quick

maintenance and repair without affecting traffic.

For a detailed description of the XDM-50 platform, see the Multiservice

Packet-Optical Transport Platform General Description.

Figure 1-1: XDM-50 shelf


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XDM-50 Shelf OptionsThe XDM-50 boasts an extremely high modular structure and is offered in two

shelf configurations:

Basic XDM-50 shelf with two identical MXC50 (Main Cross Connect)

cards for supporting system redundancy.

The lower part of the shelf consists of the INF50 redundant input DC

modules and the External Connection Unit (ECU50/ECU50-R). Above are

the MXC50 cards and the CCP50-2 connection and I/O protection module.

The upper part of the shelf consists of the modules cage which houses up to

four I/O modules. Various types of interface modules supporting PDH,

SDH, and data services are available.

All electrical connections are located directly in the tributary modules;

therefore, the XDM-50 does not need additional electrical interface

connections.

The FCU50 (Fan Control Unit) at the right of the shelf provides cooling air

to the system. It contains six separate fans for added system redundancy.

Air is drawn in by the fans from the right side of the chassis and exhausted

through the horizontally mounted cards and modules and the left side of the

chassis. Redundant controllers, located on the two MXC50 cards, activate

the fans.

In case of failure of one of the fans, the remaining fans provide redundancy

and start to operate in turbo mode until the FCU50 is replaced. The FCU50can be extracted and replaced without interrupting the multiplexer

operation, provided the replacement does not exceed a few minutes.

The basic XDM-50 cage contains slots for I/O interface modules and

dedicated slots for the MXC50 cards, the CCP50-2, INF50, FCU50, and

ECU50/ECU50-R. The cage's design and mechanical practice conform to

international mechanical standards and specifications.

The module and card slots are distributed as follows:

Four (4) slots, I1 to I4, optimally allocated for I/O interface modules

One (1) slot allocated for the ECU50 or ECU50-R card

The ECU50 or ECU50-R card is located beneath the MXC50 cards. Itsfront panel features several interface connectors for management, external

timing, alarms, and orderwire. It also includes alarm severity colored LED

indicators.


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Expanded XDM-50 shelf consists of the XDM-50 basic shelf and the TPU

expansion shelf mounted on top, to add protection of electrical I/O

modules.The TPU is a single-shelf cage with slots for the Tributary Protection

Modules (TPMs), and a Tributary Control (TC) or Tributary Control and

Fan (TCF) module. The modules are distributed as follows:

Four (4) slots flexibly allocated for TPMs (single-slot or double-slot

modules are supported)

One (1) slot allocated for the TC or TCF module

Each TPM is connected to the operating and protection modules of the

XDM-50 shelf respectively. If a failure is detected in one of the operating

I/O modules, the XDM-50 control system sends control signals to the

appropriate TPM to switch traffic from the operating I/O module to the protection module. Several types of TPM modules for 1:1, 1:2, or 1:3

protection schemes are supported.

The TC or TCF is connected to the DC and control buses of the MXC50

cards via the TPU backplane. It controls the switching of traffic from the

main to protection I/O module by relays in the corresponding TPM. In

addition, the optional TCF has three fans that provide cooling air to the

modules installed in the TPU.

The TPU is a 231 mm deep, 443 mm wide, and 75 mm high unit. It

connects to a connector on top of the XDM-50 shelf that provides the

power and control buses required for its operation. When the TPU is not

installed, a protection cap covers this connector.

Figure 1-2: Basic XDM-50 shelf layout


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XDM-100 Platform OverviewECI Telecom's XDM-100 compact multiservice platform delivers a cost-

effective and affordable mix of Ethernet, SDH, and PDH services, resulting in

new revenue-generating opportunities. It offers a wide variety of features and

benefits, including:

Gradual in-service capacity expansion based on service provisioning needs.

An optical connection operating at a specific STM rate can be upgraded

from STM-1 to STM-4/STM-16 without affecting traffic.

Sublambda grooming enabling high utilization of existing fibers and top

efficiency in transmission of different types of services.

Multi-ADM and cross-connect functionality for deployment in flexible

network topologies, such as ring, mesh, and star.

The XDM-100 is compact and resilient. Due to its extended operating

temperature range, it is well suited to harsh environmental conditions.

The XDM-100 shelf was designed to facilitate simple installation and



For a detailed description of the XDM-100 platform, see the Multiservice

Packet-Optical Transport Platform General Description.



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XDM-100 Shelf ConfigurationsThe XDM-100 shelf is available in the following shelf configurations:

Pure MSPP (also known as XDM-100) for pure SDH and data services.

By default, the pure MSPP is configured with two matrix cards and an

optional TPU shelf. The pure SDH platform may be configured with two

matrix cards or, alternatively, with a single matrix card and a single MXC-

BR card. The exact configuration can be tailored to meet specific client

requirements.

Converged MSPP/CWDM platform (also known as XDM-100H)

supports the complete range of SDH and data services and adds CWDM

functionality, serving as a single converged platform for both data and

optical features. By default, the converged platform is configured with two

matrix cards and a TPU/OCU (Optical CWDM Unit) shelf. A second

optional TPU is also available. The exact configuration can be tailored to

meet specific client requirements.

Pure CWDM platform (also known as XDM-200) focuses on pure

CWDM optical services. By default, the pure CWDM platform is

configured with one matrix card and a TPU/OCU shelf. As with all XDM

platforms, the exact configuration can be tailored to meet specific client

requirements.

Pure SDH MSPP Configuration (XDM-100)In its maximum configuration, the pure SDH MSPP accommodates thefollowing modules:

Eight (8) slots, I1 to I8, allocated for I/O interface modules.

Two (2) slots, A and B respectively, allocated for the MXC cards (main and

protection). Each MXC card has two slots (A1 and A2 and B1 and B2) to

accommodate SDH aggregate modules.

One (1) slot allocated for the ECU card.

A TPU single-shelf cage with slots for the TPMs and TC or TCF modules.

The modules are distributed as follows:

Four (4) slots flexibly allocated for TPMs (single-slot or double-slot

modules are supported).

One (1) slot allocated for the TC or TCF module.


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Converged MSPP/CWDM Configuration

(XDM-100H)The converged configuration of the XDM-100 integrates the modularity

features of both the pure MSPP and the pure CWDM:

Pure MSPP XDM-100 shelf, as described in Pure SDH MSPP

Configuration (XDM-100) (page 1-6), including:

ECU

Two (2) MXC-100/B cards

I/O modules cage with eight slots as described in Pure SDH MSPP

Configuration (XDM-100) (page 1-6)

FCU

TPU/OCU mounted on top of the basic shelf. Either one or two TPU/OCU

units may be mounted on top of the shelf, including:

Four (4) slots for supporting any mix of Mux/DeMux, splitter/coupler,

OADM, optical amplifiers, or TPM modules

One (1) TC or TCF module for carrying the power and control from the

main shelf to the TPU/OCU backplane


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XDM-100 I/O Protection OptionsThe XDM-100 shelf boasts an extremely high modular structure and can be

configured with or without I/O protection:

Basic XDM-100 shelf housed in a compact equipment cage. I/O protection

is not supported in this option.

Expanded XDM-100 with I/O protection. A TPU is mounted on top of the

basic shelf providing protection to the I/O modules.

Double-expanded XDM-100 shelf with I/O protection and enhanced

CWDM networking capabilities. An OCU is mounted on top of the

expanded XDM-100 shelf and provides increased CWDM networking

functions in addition to I/O protection.

NOTE: It is recommended that the XDM-100 shelf beinstalled in an ETSI A rack (2200 mm or 2600 mm). However,

it can also be installed in 19" 600 mm depth racks (without airfilters) that have been approved by ECI Telecom. (For detailedinformation about ETSI A racks, see section Rack Installationin the XDM-100 IMM.)

Basic XDM-100 Shelf

The basic XDM-100 shelf is housed in a 231 mm (9.1 in.) deep, 443 mm(17.44 in.) wide, and 200 mm (7.87 in.) high equipment cage. The lower part of

the shelf consists of the card cage and accommodates the MXC cards (main

and protection) and the ECU. The upper part of the shelf consists of the module

cage and houses up to eight I/O modules.

I/O protection is not supported in this option.

Figure 1-4: Basic XDM-100 shelf


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Expanded XDM-100 with I/O Protection

A TPU is mounted on top of the basic shelf and provides protection to the I/Omodules. Each TPM is connected to both operating and protection I/O modules

in the shelf in a 1:1, 1:2, or 1:3 configuration. If a failure is detected in one of

the operating I/O modules, the active MXC via the TC module in the TPU

switches the traffic from the active I/O module to the protection module.

Figure 1-5: Expanded XDM-100 shelf

Double-Expanded XDM-100An OCU is mounted on top of the expanded XDM-100 shelf. This option

provides I/O protection as the expanded XDM-100, and adds CWDMnetworking capabilities to the XDM-100.

Figure 1-6: Double-expanded XDM-100 shelf


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XDM-100H OverviewThe XDM-100H integrates the Ethernet, SDH, and PDH capabilities of the

XDM-100 with the Coarse Wavelength Division Multiplexing (CWDM)

functionality of the XDM-200. It is compact, fully modular, and redundant.

NOTE: The XDM-100H is a cost option and can only beimplemented if your XDM-100 is licensed appropriately.

A TPU/OCU shelf can be mounted on top of the XDM-100 basic shelf to add

I/O protection and optical CWDM networking capabilities. The TPU/OCU is

identical in physical dimensions to the TPU and supports any mix of TPMs,

OADMs, Mux/DeMux, and couplers/splitters. Up to two TPU/OCU shelvescan be installed on the basic XDM-100 shelf.

Due to the high capacity of the traffic carried by the XDM-100H, protection is

of the utmost importance. The protection mechanisms incorporated into the

system ensure traffic reliability. These include hardware redundancy of

specified critical circuits, highly reliable trail protection mechanisms, and

Optical Channel (OCH) 1+1 protection and Optical Multiplex Section

Protection (OMSP) for line protection.


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XDM-100H Description

The XDM-100H consists of the following units:

Basic XDM-100 shelf as described in Basic XDM-100 Shelf (page 1-8).

The shelf includes the ECU or ECU-F, two MXC cards, the I/O modules

cage with eight slots, and the FCU.

Each MXC houses an NVM module which contains the licensed optional

software.

The eight slots of the I/O modules cage support installation of XDM-100

I/O modules, as well as XDM-200 CWDM I/O modules (transponders and

combiners).

A TPU/OCU shelf mounted on top of the basic XDM-100 shelf with five

slots: four for supporting any mix of Mux/DeMux, OADM,

splitters/couplers, and TPMs, and one for a TC module. One or two

TPU/OCUs can be mounted on the basic XDM-100 shelf.

NOTE: When two TPU/OCUs are installed, the second(upper) TPU/OCU does not support low order (E1 or DS-1)signals due to cabling limitations.

Figure 1-7: XDM-100 with a TPU/OCU shelf


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XDM-100H Configuration Options

The XDM-100H has three configuration options:

Basic shelf

Expanded shelf (with one TPU/OCU)

Double-expanded shelf (with one TPU/OCU and one OCU)

All these options can be configured based on the type of system license

purchased.

TPU/OCU slots designation

One or two TPU/OCUs can be mounted on top of the basic XDM-100. Thecage on top of the basic shelf is designated M1; the cage on top of the M1 cage

is designated M2.

Slots in M1 are M1-1 to M1-5.

Slots in M2 are M2-1 to M2-5.

Figure 1-8: TPU and OCU slots designation

When the hybrid option is enabled, the M1 cage is designated TPU/OCU. It

can accommodate any mix of TPM and CWDM modules. The M2 cage is

always designated OCU and can accommodate only CWDM modules.


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Assignment options for TPU/OCU cages

The following figure shows the layout of the basic XDM-100 shelfconfiguration.

Figure 1-9: Basic XDM-100

Table 1-1: Suppor ted modules in basic and hybrid XDM-100

I/O modules cage slots I1 to I8

Regular Hybrid

Only XDM-100 I/O modules (PIMs,SIMs, EISMBs, EISMs, DIOMs)

Any mix of I/O modules (PIMs, SIMs,EISMBs, EISMs, DIOMs) and CWDMmodules (transponders and combiners)


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The following figure shows the layout of the expanded XDM-100 shelf

configuration.

Figure 1-10: Expanded XDM-100

Table 1-2: Suppor ted modules in expanded XDM-100

I/O modules cage slots I1 to I8 M1 modules cage slots M1-1 to M1-4

Regular Hybrid Regular Hybrid

Only XDM-100I/O modules(PIMs, SIMs,EISMBs, EISMs,DIOMs)

Any mix of I/Omodules (PIMs,SIMs, EISMBs,EISMs, DIOMs) andCWDM modules

(transponders andcombiners)

Only TPMs Any mix of TPM andCWDM opticalmodules (Mux/DeMux,

splitters/couplers,OADM)

NOTE: Slot M1-5 can accommodate TC modules only.


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The following figure shows the layout of the double-expanded XDM-100 shelf

configuration.

Figure 1-11: Double-expanded XDM-100

Table 1-3: Suppor ted modules in double-expanded XDM-100

I/O modu les cage slot s I1 to I8 M1 modu les cage slot s M1-1 toM1-4

M2 modules cage slots M2-1to M2-4

Regular Hybrid Regular Hybrid Regular Hybrid

Only I/O

modules (PIMs,

SIMs, EISMBs,EISMs, DIOMs)

Any mix of I/O

modules (PIMs,

SIMs, EISMBs,EISMs,

DIOMs) and

CWDMmodules

(transponders

and combiners)

Only TPMs Any mix of TPM

and CWDMoptical modules

(Mux/DeMux,

splitters/couplers,

OADM)

-- Only CWDM

optical modules(Mux/DeMux,

splitters/couplers,

OADM)

NOTE: Slots M1-5 and M2-5 can accommodate TC modulesonly.


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XDM-300 Platform OverviewECI Telecom's XDM-300 is a powerful flexible MSPP optimized for metro

networks. It supports multitude technologies in a cost-effective fashion to

address the market increasing traffic demands.

The XDM-300 supports scalable STM-1/4/16/64/OTN aggregates and flexible

access topologies. It offers a wide range of features and benefits including:

Carrier class Ethernet as well as traditional SDH voice-centric services.

Gradual in-service capacity expansion based on service provisioning needs.

An optical connection operating at a specific STM rate can be upgraded

from STM-1 to STM-4/STM-16/STM-64 without affecting traffic.

Sublambda grooming resulting in high utilization of existing fibers and top

efficiency in transmission of different types of services.

Supporting CWDM, OADM, transponder, combiner, OFA, and other

optical cards and modules used to process, amplify, and monitor

multichannel signals.

The XDM-300 shelf was designed to facilitate simple installation and



For a detailed description of the XDM-300 platform, see XDM General

Description.



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XDM-300 I/O Protection OptionsThe XDM-300 features an extremely high modular structure and can be

configured with or without I/O protection:

Basic XDM-300 shelf housed in a compact equipment cage. I/O protection

is not supported in this option.

Expanded XDM-300 with I/O protection as follows:

A TPU mounted on top of the basic shelf, providing protection to the

I/O modules in the upper module cage.

A TPU mounted at the bottom of the basic shelf, providing protection

to the I/O modules in the lower module cage.

Two TPUs mounted, one on top and one at the bottom of the basic

shelf, providing protection to the I/O modules installed in both the

upper and the lower module cages.

Expanded XDM-300 shelf with I/O protection and enhanced CWDM

networking capabilities. Two TPUs mounted one on top of the basic shelf

and one under it, for I/O protection. In addition, an OCU is mounted on top

of the upper TPU, which provides increased CWDM networking functions.

Basic XDM-300 ShelfThe basic XDM-300 shelf is housed in a 246 mm (9.68 in.) deep, 443 mm

(17.44 in.) wide, and 350 (13.78 in.) mm high equipment cage. The upper partof the shelf consists of a module cage (upper module cage) and houses up to

eight I/O modules. In the middle of the shelf is a card cage that accommodate

the MXC300 cards (main and protection), the External Connection Unit

(ECU300), and up to two I/O cards. The lower part of the shelf consists of an

additional module cage (lower module cage) that can be equipped with up to

eight I/O modules.

I/O protection is not supported in this option.


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The XDM-300 shelf can be installed in a horizontal or vertical position.

Figure 1-13: Basic XDM-300 shelf, horizontal i nstallation


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Figure 1-14: Basic XDM-300 shelf, vertical Ins tallation


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Expanded XDM-300 with I/O Protection

TPUs can be attached to the XDM-300 shelf to protect installed I/O modules.Each TPM is connected to both operating and protection I/O modules in the

shelf in a 1:1, 1:2, or 1:3 configuration. If a failure is detected in one of the

operating I/O modules, the active MXC300/MXC900 via the TC module in the

TPU switches the traffic from the active I/O module to the protection module.

Several protection configurations are possible:

A TPU mounted on top of the basic shelf, protects I/O modules residing in

the upper module cage.

A TPU mounted at the bottom of the basic shelf, protects I/O modules

installed in the lower module cage.

Two TPUs mounted one on top and one at the bottom of the basic shelf,

provide protection to I/O modules in both the upper and lower module

cages.

Figure 1-15: XDM-300 with TPU on top


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Figure 1-16: XDM-300 with TPUs on top and at the bottom


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Expanded XDM-300 with CWDM Networking

CapabilitiesAn OCU can be mounted on top of a basic XDM-300 shelf or on top of an

expanded shelf to add enhanced CWDM networking capabilities to the

platform.

NOTE: An OCU is not supported at the bottom of the XDM-300 shelf.

Figure 1-17: XDM-300 with two TPUs and an OCU


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XDM-900 Platform Overvi

xdm-100 product line rm etsi b02 8.3 en

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