IEEE Catalog Number: ISBN:

CFP1183H-PRT 978-1-4577-0145-0

2011 3rd Asia Symposium on Quality Electronic Design (ASQED 2011)

Kuala Lumpur, Malaysia 19-20 July 2011

2011 ASQED – Table of Contents

SESSION 1A Advanced Packaging and Signal Integrity Chair: Farhang Yazdani, BroadPak Corporation

1A.1: Thermal Modeling of Three-Dimensional Integrated Circuits Considering the Thermal Removal Capability of Different TSVs.................................................................................................... 1 Hua Ding, Wei Wang, Zhiliang Qian, Chiying Tsui, Hong Kong University of Science and Technology; Liangzhen Lai, University of California, Los Angeles

1A.2: Package Design Optimization for Efficient On-Chip Capacitance Leveraging.................................. 8 Fern Nee Tan, Intel Microelectronics; Fern Nee Tan, Sheng Chyan Lee, Abdul Rahman Faidz, Universiti Tunku Abdul Rahman

1A.3: Signal Integrity and Scalability Study of a Novel PoP Inter-Package System................................. 13 Jackson Kong, Bok Eng Cheah, Shanggar Periaman, Kooi Chi Ooi, Intel Malaysia

1A.4: Influence of the Heat Sink Orientation and Fins Arrangement on the Thermal Behavior of High Power LED................................................................................................................................. 21 Nadarajah Teeba, Permal Anithambigai, Kandasamy Dinash, Devarajan Mutharasu, Universiti Sains Malaysia (USM)

SESSION 1B Advances in Analog IC Design Chair: Volkan Kursun, Hong Kong University of Science and Technology

1B.1: An Automatic Phase Control Circuit with DLL-like Architecture for Phased Array Antenna Systems........................................................................................................... 25 Toshiyuki Kikkawa, Toru Nakura, Kunihiro Asada, The University of Tokyo

1B.2: NBTI-induced 8-Bit DAC Circuit Mismatch in System-On-Chip (SoC).............................................. 29 Mohd Azman Abdul Latif, Intel Corporation; Noohul Basheer Zain Ali, Fawnizu Azmadi Hussin, University of Technology PETRONAS

1B.3: A 3.1-10.6 GHz Frequency Tunable Ultra Wideband LNA .................................................................. 37 Guo-Ming Sung, Chia-Yu Hsu, Chiu-Lung Shen, National Taipei University of Technology

1B.4: On-Chip 1.8 V Step Down DC/DC Converter with 94% Power Efficiency ......................................... 42 Prajakta Panse and Tonse Laxminidhi, National Institute of Technology Karnataka

SESSION 1C Low-Cost and Efficient Testing Chair: Chin Hai Ang, Altera Corporation

1C.1: A Complete Methodology for Determining Memory BIST Optimization under Wrappers Sharing Constraints .................................................................................................. 46 Lilia Zaourar, LIP6 Laboratoire; Yann Kieffer, G-SCOP Laboratoire; Arnaud Wenzel, STMicroelectronics

1C.2: Build-In-Self-Test of FPGA For Diagnosis of Delay Fault .................................................................. 54 Nachiketa Das, Pranab Roy, Hafizur Rahaman, Bengal Engg. & Science University Shibpur; Parthasarathi Dasgupta, Indian Institute of Management, Calcutta

1C.3: Outlier Distribution Detection Approach to Semiconductor Wafer Fabrication Process Monitoring................................................................................................................................ 62 Huiyuan Cheng, Melanie Po-Leen Ooi, Ye Chow Kuang, Monash University; Serge Demidenko, RMIT International University; Bryan Cheah, Freescale Semiconductor

SESSION 2A High Performance Memory and Logic Circuits Chair: Young Hwan Kim, Pohang University of Science and Technology

2A.1: Application-Specific Selection of 6T SRAM Cells Offering Superior Performance and Quality with a Triple-Threshold-Voltage CMOS Technology ..................................................... 68 Hong Zhu and Volkan Kursun, Hong Kong University of Science and Technology

2A.2: Near-Threshold 40nm Supply Feedback C-Element........................................................................... 74 Idan Schwartz, Adam Teman, Alexander Fish, Ben-Gurion University of The Negev, Rostislav (Reuven) Dobkin, vSync Circuits Ltd.

2A.3: A White LED Backlight Driving IC with 3-Bit Dimming Controller .................................................... 79 Guo-Ming Sung, Sheng-Kai Peng, Yen-Tang Chang, National Taipei University of Technology

SESSION 2B MEMS and Biochips Chair: Zhiyong Fan, Hong Kong University of Science and Technology Co-Chair: Johnny C. Ho, City University of Hong Kong

2B.1: Routing-Aware Placement Technique for Intelligent Collision Avoidance in Digital Microfluidic Biochips................................................................................................................. 85 Pranab Roy, Hafizur Rahaman, Bengal Engineering and Science University, Shibpur; Parthasarathi Dasgupta, Indian Institute of Management, Calcutta

2B.2: Comparison of Isotropic Dry Etching Process using XeF2 and Anisotropic Wet Etching Process using EDP for Microhotplate Device....................................................................... 95 Zarina Tardan, Universiti Sains Malaysia (USM); Dr Zaini Abdul Halim, CEDEC, USM

2B.3: Effect of Heater Geometry on the High Temperature Distribution on a MEMS Micro-hotplate .................................................................................................................. 100 Othman Sidek, Mohammad Zulfikar Ishak, Muhammad Afif Khalid, Mohamad Zailani Abu Bakar, Muhamad Azman Miskam, Universiti Sains Malaysia (USM)

SESSION 2C On-Chip Interconnects and Communication Chair: Farhad Mehdipour, Kyushu University

2C.1 - Invited Paper: Display Signal Interface Techniques for Mobile Applications............................... 105 Kyoungrok Cho, Sang-Jin Lee, Seok-Man Kim, Doo-Hwan Kim, Chungbuk Nat’l University

2C.2: Power-Reliability Tradeoff in Low Power 4-PAM Signaling in On-chip Communication.............. 109 Arash Abtahi Forooshani, Fakhrul Zaman Rokhani, Khairulmizam Samsudin, University Putra Malaysia; Fakhrul Zaman Rokhani, Intel Microelectronics; Hamid Behzadipour, ANSARI GmBH

2C.3: A New Statistical Electromigration Analysis Methodology that Incorporates Across-Chip Temperature Variation................................................................................................... 115 Ted Sun, Ayhan Mutlu, Mahmud Rahman, Santa Clara University; Ted Sun, Integrated Device Technology; Ayhan Mutlu,, Extreme DA Corp.

2C.4: A Fully On-Chip Throughput Measurement System for Multi-Gigabits/s On-Chip Interconnects ........................................................................................................................ 119 Amit Vishnani, Marshnil Dave, Maryam Baghini, Dinesh Sharma, Indian Institute of Technology Bombay

SESSION 3A Statistical Timing and Leakage Analysis Chair: Amine Bermak, Hong Kong University of Science and Technology Co-Chair: Farhad Mehdipour, Kyushu University

3A.1: Timing Yield Slack for Statistical Optimization................................................................................. 125 Eun Ju Hwang, Young Hwan Kim, Pohang University of Science and Technology; Wook Kim, Samsung Electronics

3A.2: Assessment of Nano-scale Asynchronous PCFB Circuits under Extreme Process Variation................................................................................................................................. 134 Mohsen Raji, Behnam Ghavami, Hamid R. Zarandi, Hossein Pedram, Amirkabir University of Technology

3A.3: A Prediction Model For Estimating Leakage Power Consumption of Routing Resources in FPGAs............................................................................................................. 140 Behzad Salami and Morteza Saheb Zamani, Amirkabir University of Technology

3A.4: Statistical Leakage Analysis by Parallel Monte-Carlo Programming on a CUDA Platform............................................................................................................................. 146 Jungil Ahn, Jinwook Kim, Young Hwan Kim, Pohang University of Science and Technology (POSTECH)

SESSION 3B Noise Analysis and Characterization Chair: Volkan Kursun, Hong Kong University of Science and Technology Co-Chair: Hisayo S. Momose, Toshiba Corporation

3B.1: A Novel and Fast Method for Characterizing Noise Based PCMOS Circuits................................. 151 Anshul Singh, Satyam Mandavalli, International Institute of Information Technology, Hyderabad; Vincent Mooney III, Georgia Institute of Technology; Anshul Singh, Vincent Mooney III, Keck-Voon Ling, Nanyang Technological University

3B.2: Finding the Worst Case Supply Noise Excitation Methodology for High Speed I/O Interfaces.................................................................................................................... 161 Fern Nee Tan, Intel Microelectronics; Fern Nee Tan, Sheng Chyan Lee, Faidz Abdul Rahman, Universiti Tunku Abdul Rahman

3B.3: Reliability Analysis of Digital Circuits Considering Intrinsic Noise ............................................... 167 Veit B. Kleeberger and Ulf Schlichtmann, Technische Universität München

3B.4: IR Drop Analysis in Single- and Multi-Wall Carbon Nanotube Power Interconnects in Sub-Nanometer Designs ................................................................................................................. 174 Debaprasad Das and Hafizur Rahaman, Bengal Engineering and Science University, Shibpur

SESSION 3C Fault Detection and Correction Chair: Cha-Keon Cheong, Hoseo University Co-Chair: Chin Hai Ang, Altera Corporation

3C.1: Detectability Analysis for Resistive Open Faults with Dynamic Supply Voltage Scaling Awareness .............................................................................................................................. 184 Mohamed Tag Elsir Mohammadat, Noohul Basheer Zain Ali, Fawnizu Azmadi Hussin, Universiti Teknologi Petronas, Malaysia

3C.2: Low Power Self-Checking Two-Rail Code Checker Design............................................................ 191 Shao-Hui Shieh, National Chin-Yi University of Technology

3C.3: A Symbolic Model-Based Diagnosis with Auto-correction Framework for Arithmetic Circuits ......................................................................................................................... 195 Bijan Alizadeh, University of Tehran

SESSION 4A Nanoelectronic Devices and Circuits Chair: Hyunhyub Ko, Ulsan National Institute of Science and Technology Co-Chair: Johnny C. Ho, City University of Hong Kong

4A.1: Random Work Functions Induced DC and Dynamic Characteristic Fluctuations in 16-nm High-k/Metal Gate CMOS Device and Digital Circuit............................................................. 203 Hui-Wen Cheng and Yiming Li, National Chiao Tung University

4A.2: Enhanced Synthesis Method to Prepare Crystalline GaAs Nanowires with High Growth Yield ................................................................................................................................ 207 Ning Han, Fengyun Wang, Alvin T. Hui, Jared J. Hou, Guangcun Shan, Fei Xiu, Tak Fu. Hung, Johnny C. Ho, City University of Hong Kong

4A.3: Uniform Diameter and Pitch Co-Design of 16nm N-type Carbon Nanotube Channel Arrays for VLSI...................................................................................................................... 211 Yanan Sun and Volkan Kursun, Hong Kong University of Science and Technology

4A.4: Simulation Study of Open Circuit Voltage Loss at Schottky Top Contact in Ultra-Shallow Junction Silicon Solar Cells ................................................................................... 217 Miao YU and Zhiyong FAN, Hong Kong University of Science & Technology

4A.5: Optimization of Arsenic and Phosphorus Source/Drain Implantation for Low Power NMOS Device.................................................................................................................... 221 Ai Qiang, Jerry Foo Sen Liew, Wilson Entalai, Kim Eui Choong, X-FAB Sarawak

SESSION 4B Advanced VLSI Architectures and Applications Chair: Young Hwan Kim, Pohang University of Science and Technology

4B.1: Memory Reduction of IFFT Using Separated CIM (Combined Integer Mapping) Method............. 225 In-Gul Jang, Ze-Hua Dong, Jin-Gyun Chung, Chonbuk National University; Chul-Dong Lee, Korea Electronics Technology Institute

4B.2: Hardware and Software Requirements for Implementing a High-Performance Superconductivity Circuits-Based Accelerator ............................................................................... 229 Farhad Mehdipour, Hiroaki Honda, Koji Inoue, Kazuaki Murakami, Kyushu University

4B.3: Interpolation Circuit Design for XRF Systems Using FFT ............................................................... 236 Zhe-Yan Piao, Won-Suk Song, In-Gul Jang, Jin-Gyun Chung, Chonbuk National University; Chul-Dong Lee, Korea Electronics Technology Institute

4B.4: An Approach to Code Compression for CGRA................................................................................. 240 Seongsik Park and Kiyoung Choi, Seoul National University

4B.5: Analysis, Modeling and Optimization of Transmission Gate Delay................................................ 246 Sabir Ali Mondal, Somsubhra Talapatra, Hafizur Rahaman, Bengal Engineering. and Science University, Shibpur

SESSION 4C Sensors and Displays Chair: Kyoungrok Cho, Chungbuk National University Co-Chair: Hisayo S. Momose, Toshiba Corporation

4C.1: VPIC-based Image Compression Technique for Sensor Network Applications............................ 254 Yan WANG, Amine BERMAK, 1Hong Kong University of Science and Technology; Farid BOUSSAID, University of Western Australia

4C.2: Robust Gas Recognition using Adaptive Thresholding .................................................................. 258 Jaber Hassan J Al Yamani, Farid Boussaid, The University of Western Australia; Amine Bermak, Hong Kong University of Science and Technology

4C.3: A Novel Integrated Amorphous Silicon TFT Gate Driver Circuit with Optimized Design for TFT-LCD Display Panel Manufacturing ........................................................ 262 I-Hsiu Lo, Hui-Wen Cheng, Yiming Li, Po-Jui Lin, Cheng-Han Shen, National Chiao Tung University

4C.4: Design of Lane Detection System Based on Color Classification and Edge Clustering.............. 266 Cha-Keon Cheong, Hoseo University

SESSION 1P Poster Papers Chair: Volkan Kursun, Hong Kong University of Science and Technology

1P.1: NBTI Degradation with Optimized ID-VG Sweep for Wafer Fabrication Monitoring........................ 272 Foo Yew Soon and Norhayati Soin, University of Malaya

1P.2: 0.18um Low Voltage 12-Bit Successive-Approximation-Register Analog-to-Digital Converter (SAR ADC) ............................................................................................ 277 Mei Yee Ng, MIMOS Berhad

1P.3: Linearization of GaN Power Amplifier Using Feedforward and Predistortion Techniques ........................................................................................................................................... 282 Muhammad Abuelma'atti, King Fahd University of Petroleum and Minerals; Abdullah M.T. Abuelmaatti, Tk. Yeung, COMDEV Europe Ltd; G. Parkinson, University of Manchester

1P.4: A New Functional Model For Wireless Communication Class-AB Solid-State Bipolar Power Amplifiers .................................................................................................................... 288 Muhammad Abuelma'atti, King Fahd University of Petroleum and Minerals; Abdullah M.T. Abuelmaatti, COMDEV Europe Ltd.

1P.5: The Development of an Enhancement-Mode Single-Transistor SONOS Cell in 0.13µm Technology...........................................................................................................................292 Dony Kaba, Chuan Chien Alexander Tan, Boon Jiew Chee, Seok Sewoon, X-FAB Sarawak

1P.6: A New Architecture for T Flip Flop using Quantum-Dot Cellular Automata .................................. 296 Mohammad Torabi, University of Malayer

1P.7: Multi-Stage Parallel Processing of Design Element Access Tasks in FPGA-based Logic Emulation Systems............................................................................................. 301 Somnath Banerjee and Tushar Gupta, Mentor Graphics Pvt. Ltd., India

1P.8: Study on the Variation in Thermal Resistance and Junction Temperature of GaN-based LEDs Using Thermal Transient Measurement ...............................................................310 Nadarajah Teeba, Lee Kean Yew, Lee Chin Keng, Permal Anithambigai, Kandasamy Dinash, Devarajan Mutharasu, Universiti Sains Malaysia (USM)