8 049 : 2 ; :00 1 4 4 - penchem heat... · 2019. 8. 9. · en485-4 0 50 100 150 200 250 300 350 400...

PENCHEM TECHNOLOGIES SDN BHD (767120-A)

1015, Jalan Perindustrian Bukit Minyak 7, Kawasan Perindustrian Bukit Minyak, Mk.13, 14100 Penang, Malaysia. T: +604-501 5973, 74, 75, 76, 77, 78, 79 E: [email protected] W: www.penchem.com

Manufacturer of High Performance Polymers ● LED Epoxies ● SMT Epoxies ● UV Epoxies ● Silver Epoxies ● COB Epoxies ● Potting Epoxies ● Polyurethanes

● Epoxy Sealants ● Silicones ● Thermal Interface Materials ● Fiber Optics Epoxies ● Customized Products

www.penchem.com

Heat Curable Epoxy Adhesive Application Notes





Introduction to epoxy resins Application Table of properties of products Reliability data

A family of thermoset resins which have the following chemical group: When reacted with a hardener (or curing agent), they set to a hard mass

which does not melt or dissolve in solvents. Hardeners are typically based on amine or anhydride chemistry.

Technology Content

Introduction What are epoxy resins?

Oxirane group

Types of epoxy resins

Diglycidyl ether bisphenol A epoxy (DGEBA), common grade

Diglycidyl ether bisphenol F epoxy (DGEBF), lower viscosity

Cycloaliphatic epoxide (bisphenol A (BPA) free, low chlorine content & low viscosity)





Crosslinking reaction of epoxy resins

Epoxy-amine system

Two component system, cure at room or elevated temperature, longer pot life can be achieved by using modified amine or amine adduct.

Epoxy-amine system

Epoxy-anhydride system

One or two component system, compared to epoxy-amine cured systems, it has a longer curing time, higher curing temperature, better moisture resistance, better heat and UV

resistance, low discoloration and lower cure shrinkage. Suitable for making large moldings and has good electrical, chemical, and mechanical properties.





Exceptions are plastics materials like polyethylene, polypropylene, Teflon, etc.

Advantages of Epoxies

Bonds strongly to most materials

(metals, concrete, glass, ceramics,

stone, wood, leather).

Excellent chemical and solvent resistance.

Very good electrical insulating properties.

Outstanding mechanical strength

including tensile, compressive, flexural

and modulus.

Low cure shrinkage (good dimensional

stability).

Epoxies for Electrical and Electronic Applications

Encapsulating of semiconductors and electronic component. Potting active and passive components. Silver epoxy to replace solder for mounting heat sensitive

components. Structure adhesive and sealant for electronic components Underfill for BGA (ball grid array) Thermal interface materials





High Temperature Curing Epoxy Adhesive

1-part epoxy system with curing profile above 100°C. Advantages of high temperature curing system for epoxy

adhesive:

Shorter curing time, high productivity

High glass transition

Excellent adhesion strength.

Penchem products: GL616, GL168, GL168-2 and GL158

Stable pot life at 25°C and long shelf life at -20°C.

High thixotropic index which can control the flow of the adhesive without sagging.

Cure fast at elevated temperature and have excellent adhesion to most pc boards and electronic components even after 1000 hours reliability testing.

Designed especially for bonding electronic components.

Relatively low viscosity for faster dispense from syringes and better processing using GA23.

GL616 has tested stable at 25°C for >200 days.

GL168-2 is suitable to bond gold, nickel, Kovar and plastics.

Penchem products: EN479 and EN485-4

Stable pot life at 25°C and long shelf life at -20°C.

High thixotropic index and viscosity version

Suitable with needle tip GA21 for faster dispensing output.

Cure fast at high elevated temperature and have excellent adhesion to most PC boards and variety of metal substrates.

High stability after 1000 hours reliability testing.

Designed especially for bonding electronic components.





Test Parameter

Reference Test Method

Unit Instrument

MS

L8

5°C

/85%

RH

Moisture intake after 168 hours JEDEC

J-STD-20C %

Espec Humidity chamber

SH221/Ametek model 5KN0185

0 hour, Die shear strength, chip to SS

JEDEC J-STD-20C/

ASTM D4501-01 kgf/cm2

Espec Humidity chamber

SH221/Ametek model 5KN0185

168 hours, Die shear strength, chip to SS



LT

OL

-40

°C

0 – 72 hour ASTM D4501-01 kgf/cm2 Freezer/ Ametek model

5KN0185

Test Parameter Reference Test Method Unit Instrument

Pot life, 25°C ASTM 1338-91 Day - Viscosity,25°C

ASTM D1084-88 cP Brookfield Viscometer

CAP 2000+ Thixotropic index - Flow test 45 degree, 25°C, 30min ASTM D2202-00 mm Flow test plate

Density of solid ASTM D1475-98 g/cm3 Density kit attached to

Semimicro Balance XS205

Hardness ASTM D2240-97 Shore D Teclock durometer

shore D Die shear strength, on metal chip to SS

- kgf/ cm2 Ametek Tensile model

5KN0185 Glass transition, Tg

ASTM E831/ D3386-94 °C

Mettler Toledo TMA model TMA 1

CTE, a1 ppm/K

CTE, a2 Modulus at -40°C

ASTM D4440/D5279/ D4065 - 12/

MPa Mettler Toledo DMA

model DMA 1 Modulus at 30°C Modulus at 120°C Weight Loss at 85°C

ASTM E1131/ D6370-99/ D3850-12

% Mettler Toledo TGA

model TGA 1 Weight Loss at 100°C Weight Loss at 150°C

Thermal conductivity ASTM D7984 W/mK Thermal Conductivity

Meter

Table of Test Standard and Instrument





Test Parameter Unit GL616 GL168 GL158 GL168-2 EN479 EN485-4

Application QSFP and structural bonding

QSFP and structural bonding

QSFP and structural bonding

High viscosity and gold bonding

Low CTE, high

viscosity, high temp. resistance

Low CTE, High strength adhesive on

metal

Curing Profile - 100°C/2hr 100°C/2hr 100°C/1hr 100°C/1hr

150°C/30min

120°C/1hr 150°C/30mi

n

120°C/2hr 150°C/1hr

Chemical type - Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy

Appearance - Off White Off White Off White Off White Black Black

Shelf life, -20°C Month 12 12 12 12 6 6

Pot life, 25°C Day 7 7 7 7 7 7

Viscosity,25°C cP 28,000 45,000 35,000 135,000 730,000 31,500

Thixotropic index - 1.8 1.9 1.6 >1.6 1.6 1.3

Flow test 45 degree, 25°C, 30min

mm No flow No flow No flow No flow No flow Slight Flow

Density of solid g/cm3 1.2 1.3 1.3 1.3 1.9 1.6

Hardness Shore D 85 85 85 86 85 94

Die shear strength, on metal chip to SS

kgf/ cm2 267 211 187 310 348 336

Glass transition, Tg °C 128 131 130 121 140 129

CTE, a1 ppm/K

59 57 65 51 25 36

CTE, a2 151 157 158 161 98 134

Modulus at -40°C

MPa

1483 2232 2122 2210 4391 3625

Modulus at 30°C 1207 1912 1776 1870 3678 3012

Modulus at 120°C 548 1236 1199 1241 25 36

Weight Loss at 85°C

%

0.05 0.08 0.13 0.07 0.166 0.015

Weight Loss at 100°C 0.07 0.09 0.18 0.16 0.233 0.021

Weight Loss at 150°C 0.156 0.131 0.345 0.52 0.519 0.025

Thermal conductivity W/mK 0.532 0.592 0.563 0.605 0.554 0.548

Table of Properties





0

500

1000

1500

2000

2500

3000

3500

4000

4500

5000

-40°C 30°C 120°C

Sto

rage M

odulu

s, M

Pa

Temperature,°C

Storage Modulus At Different Temperature

GL616

GL168

GL158

EN479

EN485-4

0

50

100

150

200

250

300

350

400

0 hour 168 hours 500 hours 1000 hours

Adhesi

on S

trength

, kgf/

cm²

MSL85°C/85%RH Duration

Die Shear Strength After MSL85°C/85%RH

GL616

GL168

GL158

EN479

EN485-4

Graph 1: The storage modulus data for GL616, GL168 and GL158. Method: ASTM D4440/D5279/D4065 - 12 Instrument: Mettler Toledo model DMA 1


Graph 2: The die shear strength after 1000 hours MSL85°C/85%RH of GL616, GL168 and GL158.

Method: JEDEC J-STD-20C/ ASTM D4501-01, chip (5.6601 mm²) to stainless steel Instrument: Espec Humidity chamber SH221/Ametek model 5KN0185

Storage Modulus at Different Temperature





Test Parameter Unit GL616 GL168 GL158 EN479 EN485-4

MS

L8

5°C

/85%

RH


kgf/cm2

267 211 187 348 336


260 223 201 214 228


306 193 223 226 254


248 176 188 209 243

LT

OL

-4

0°C

0 hour kgf/cm2

267 211 187 348 336

72 hours 197 190 164 245 251

Test Parameter Reference Test

Method Unit Instrument EN479 EN485-4

TS

-4

0°C

- 1

00

°C,

dw

ell

time

≥ 5

min

, tr

an

sfe

r tim

e ≤

0 cycle

ASTM D4501-01 kgf/cm2 Freezer/ Ametek model 5KN0185

348 336

10th cycle 278 330

20th cycle 271 347

30th cycle 228 351

Die Shear Strength After LTOL -40°C

Table of Reliability Data

Graph 3: The die shear strength after LTOL -40°C of GL616, GL168 and GL158. Method: ASTM D4501-01, chip (5.6601 mm²) to stainless steel

Instrument: Freezer/ Ametek model 5KN0185

0

50

100

150

200

250

300

350

400

0 hour 72 hoursAdhesio

n S

trength

, kgf/

cm

²

LTOL -40°C Duration


GL616

GL168

GL158

EN479

EN485-4





1-part or 2-part epoxy system with curing profile lower than 100°C. Advantages of low temperature curing system for epoxy adhesive or

potting:

Suitable for heat sensitive part such as camera module, fibre optic, etc.

Cost effective

Low Temperature Curing Epoxy System

Penchem products: EN418-1 and EN418-2

1-part system.

Cures fast at low temperature.

The cured epoxy provides good high temperature performance, excellent adhesion strength to most printed circuit board and gold, nickel, Kovar and Ultem.

High glass transition, Tg and low coefficient of thermal expansion, CTE.

The rheology has been adjusted to control excessive overflow.

Penchem products: GL104-2, PT497-3, PT605

2-part amine-based system.

PT605 can be cured at room temperature 25°C.

After cure surface is glossy and blush free.

Mixed epoxy has low viscosity to ensure good flow, good seepage into every corners and minimal trapping of bubbles.

Flexible system.

Low storage modulus.

Enhanced adhesion and wets glass, ceramics, most plastics and metals well.

Specially developed for low stress bonding, potting and encapsulation of electronic components.





Test Parameter Unit EN418-1 EN418-2 GL104-2 PT605 PT497-3

Applications

Hermetic Seal, OSA and structural bonding

Hermetic Seal, OSA and gold

bonding Low Temp. cure 2-parts potting

Flexible bonding and 2 parts

potting

High strength bonding and 2 parts potting

Curing profile - 85-100°C/1hr 85-100°C/1hr 75°C/1hr 25°C/24hr 80°C/3hr

25°C/24hr 100°C/30min

Chemical type - Epoxy Epoxy Epoxy Epoxy Epoxy

Appearance - Black Black Slightly

yellowish Black Clear Liquid

Mix ratio, by weight - 1 1 1:1 2:1 3:1

Filler Content% - 50 50 0% <25% 0%

Shelf life Month Storage @ -20°C Storage @ 25°C

6 6 12 12 12

Pot life, 25°C Day 1 2 1 hour 2 hours 2 hours

Viscosity, 25°C cP 25000 21000 5600 3200 1050

Thixotropic index - 1.45 2.55 NA NA NA

Flow test 45°, 25°C, 30min

- Slight Flow No flow Flow Flow Flow

Density g/cm3 1.5 1.5 1.1 1.4 1.16

Hardness Shore D 88 88 70 37 (A) 82

Refractive index, 25°C - NA NA 1.531 NA 1.539

Die shear strength, SS

kgf/cm2 265 262 259 77 300

Glass Transition, Tg °C 133 133 52 24 >95

CTE, a1 ppm/K

37 37 58 40 53

CTE, a2 138 132 219 181 188

Modulus at -40°C

MPa

4564 3888 2478 2793 1574

Modulus at 30°C 3880 3228 1671 35 1161

Modulus at 120°C 1241 953 3 7 12

Weight Loss at 85°C % 0.1136 0.1137 0.3568 0.2566 0.2720

Weight Loss at 100°C 0.1419 0.1417 0.5724 0.3618 0.3626

Weight Loss at 150°C % 0.3092 0.2950 0.9256 0.5890 0.6231

Table of Properties





Test Parameter Unit EN418-1 EN418-2 GL104-2 PT605

MS

L8

5°C

/85%

RH


kgf/cm2

265 262 259 77


188 244 140 96


246 280 154 71


237 310 158 61

LT

OL

-4

0°C

0 hour 265 262 259 77

72 hours 222 245 237 83

Graph 4: The storage modulus data for EN418-1, EN418-2, EN479, EN485-4, GL104-2, PT497-3 and PT605.

Method: ASTM D4440/D5279/D4065 - 12 Instrument: Mettler Toledo DMA model DMA 1

Reliability Data

Storage Modulus at Different Temperature

0

500

1000

1500

2000

2500

3000

3500

4000

4500

5000

-40°C 30°C 120°C

Sto

rage M

odulu

s,

MP

a

Temperature,°C

Storage Modulus At Different Temperature

EN418-1

EN418-2

GL104-2

PT605

PT497-3





Graph 5: The die shear strength after 1000 hours MSL85°C/85%RH of EN418-1, EN418-2, EN479, EN485-4, GL104-2 and PT605.

Method: JEDEC J-STD-20C/ ASTM D4501-01, chip (5.6601 mm²) to stainless steel Instrument: Espec Humidity chamber SH221/Ametek model 5KN0185


Graph 6: The die shear strength after LTOL -40°C of EN418-1, EN418-2, EN479, EN485-4, GL104-2 and PT605.

Method: ASTM D4501-01, chip (5.6601 mm²) to stainless steel Instrument: Freezer/ Ametek model 5KN0185

0

50

100

150

200

250

300

350

400

0 Hour 168 Hours 500 Hours 1000 Hours

Adhesi

on S

trength

, kgf/

cm²

MSL85°C/85%RH Duration


EN418-1

EN418-2

EN479

EN485-4

GL104-2

PT605

0

50

100

150

200

250

300

350

400

0 Hour 72 Hours

Adhesi

on S

trength

, kgf/

cm²

LTOL -40°C Duration


EN418-1

EN418-2

EN479

EN485-4

GL104-2

PT605






Accelerated Reliability Data

Test Parameter Unit EN418-1 EN418-2 EN418-6 EN479 EN485-4 GL168-2 PT479-

3

PC

T 1

21°C

, 2

atm

, 1

00

%R

H


kgf/cm2

236 358 195 202 257 310 301


197 182 173 188 232 137 194


163 196 169 178 221 145 138

Product Packaging

8 049 : 2 ; :00 1 4 4 - penchem heat... · 2019. 8. 9. · en485-4 0 50 100 150 200 250 300 350 400...

Documents