Strategi Merekabentuk Papan Litar Tercetak (PCB)

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Strategi Merekabentuk Papan Litar Tercetak (PCB)KL 3083 Rekabentuk Sistem Hilmi Sanusi

Strategi Awal Spesifikasi Dimensi Susun-atur komponen

Aplikasi Kegunaan alat pada tahap frekuensi: DC Frekuensi rendah Julat audio Frekuensi tinggi Gelombang mikro

Persekitaran Hingar dari EMC RFI dan EMI Julat suhu

SpesifikasiAkan menghadkan rekabentuk dari segi Kekangan bentuk dimensi, bulat, bujur, segi empat tepat dll bentuk PCB

Kekangan susun-atur komponen input, output, penyesaran haba, bypass capacitor

Aplikasi Litar Keperluan yang sesuai bagi rekaan PCB pembumian lebar track jenis dielectric ketebalan track

Keperluan bagi track Arus Isyarat yang melaluinya Analog Digital

Gangguan dari perambatan yang terhasil dari arus yang mengalir dalam track

Hasil dari keperluan litar Jenis pembumian yang sesuai Penyusunan modular melalui segmen interaksi EMC

Jenis track Bus track corner junction

Jenis pad luas pad kedudukan pad jenis pad

Jenis penyambungan Jumper via

PCB

Low Frequency

High frequency

DC

High frequency

Low frequency < 400Hz

Microwave

Audio range

Noise Interference Power line modulation Back propagation from switching single layer Double layer (Isolation) grounding

Emc rfi & emi Capacitive and inductive effect of the track and patch Track corner Shielding effect Skin effect Multiple layer Two layer (microstrip)

Application

Operating frequency

Dimension limitation and component

Specification

Track width Type of ground Interconnect

Component selection to satisfy the Specification Footprint of the selected component

Segmentation Modular

What are the information needed Layer / type of the board EMC Track width Overall design Modular / segment / component placement PCB shape and dimension limitation Components selection Footprint and dimension

Overall design

Overall design

Overall design

Components selectionDimension Footprint Usage - Tolerance - specification - rating

Module (PCB) placement in the system

Circuit BOM (specification)

Components selection Based on Rating Specification dimension

Components footprint

Components dimension

Components: dimension and footprint

Components: dimension and footprint

PCB - dimension

Placement of components

Placement of components pad (footprint)

Routing of the track

Routing of the track

Adjustment to the components

Re-routing of the track

Track of the PCB

Component side of the PCB

PCB software: example

schematic diagram: netlist

Rat-nest of the netlist

Interconnect: via

Simple Quiz .??